Journal of Applied Science, Information and Computing

Effect of complex agent in the formation of copper selenide (CuSe) Thin Films on Optical and Structural Properties

JASIC ID: 5f68b3b677 January 1, 2026

Effect of complex agent in the formation of copper selenide (CuSe) Thin Films on Optical and Structural Properties

Babatunde Rasaq Ayinla, Akinroye Babatunde Morufu, Abdulsalam Faridah Feyisayo, Bakare Sulaimon Oluwasegun, Oriyomi Evelyn Simileoluwa
Published January 1, 2026 Pages 171-177

Article Abstract

Thin films solar cell (TFSC) has been considered as cohort to silicon solar cell due to their thin layers of materials required to absorb the electromagnetic radiations. TFSC needs at least two classes of semiconducting materials: a high optical bandgap employs as window layer and low optical band gap uses as absorber layer. Cadmium sulphide (CdS) grown by chemical bath deposition techniques commonly uses as a window layer but it contains a toxic element. In this study, CuSe thin films were deposited on soda lime glass substrates using chemical bath deposition method and the effect of complex agent was optimized at varying volume of TEA between 2.0 and 8.0 ml. The effect of variation of volume of TEA was investigated on optical and structural properties of the films. The optical properties revealed that the films have low absorbance, reflectance and high transmittance in the visible region of electromagnetic spectrum. The films have high optical band gap between 4.13 and 3.80 eV. The variation of the films has no effect on the structural property as the films are all amorphous as revealed by XRD. The findings show that the CuSe film can be used as a window and buffer layers in the heterojunction (TFSC).

Indexed Terms

Cohort Semiconducting Window Volume
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How to Cite this Article

Babatunde Rasaq Ayinla, Akinroye Babatunde Morufu, Abdulsalam Faridah Feyisayo, Bakare Sulaimon Oluwasegun, Oriyomi Evelyn Simileoluwa. "Effect of complex agent in the formation of copper selenide (CuSe) Thin Films on Optical and Structural Properties." Journal of Applied Science, Information and Computing , vol. 7 , no. 1 , 2026 , pp. 171-177

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